ABB 5SHY3545L0016 IGCT module (3BHB020720R0002)

​Basic product information

Device Specification

Device type: IGCT (Integrated Gate Converter Thyristor) module

Voltage level: 4500   V, chip size 91   mm

physical parameters

Total weight: 2.8 kg

Exterior length: 29   cm

Packaging quantity: 1 piece/set; Spare Parts Classification Spare_Parts

Origin and Supply Location

Development source: Switzerland; Production related to Finland; Delivery warehouses: New Berlin, USA, Beijing, China, Singapore, Tokyo, Japan, Bangalore, India.

Customs code: 85413000; UNSPSC：32111700

Compliance Statement

Not within the jurisdiction of WEEE (Business To Business, B2B industrial spare parts).

The dual-use item, with export control number ECN   3A001g2, is subject to international export control regulations and requires a permit for export.

Important differences from the old model 3BHB013085R0001

The new model 3BHB020720R0002 has replaced the door pole drive unit with a brand new one. The usage of the fiber optic interface is different from the old version, which is a key point of on-site replacement:

The module has two fiber optic connectors:

One channel is the receiving channel: in actual use, it receives fiber optic trigger gate control commands;

The other channel is the sending channel: used to output IGCT status, which is not used in this model and is vacant.

The fiber optic transceiver of old material 3BHB013085R0001 needs to be wired; The new component is only connected to the receiving fiber optic cable, and the sending fiber optic cable is not wired.

When replacing spare parts on site, if the old system’s dual fiber optic wiring is directly used, abnormalities may occur and the fiber optic wiring needs to be adjusted.

Hardware physical description

The complete set of components consists of 5SHY3545L0016 IGCT power chip and GVC736BE101 gate driver board (3BHE019719R0101) assembled into a complete IGCT component.

Physical photo: A circular IGCT silicon wafer is located at the top, with a gate driven PCB board below. A large number of electrolytic capacitors, power devices, fiber optic interface CN8, and multi pin power connectors are distributed on the board; Assemble the base structure as a whole.